14 Patents
- US125061022025Fully Molded Semiconductor Structure with Face Mounted Passives and Method of Making the Same
Deca Technologies USA, Inc.
0 cites - US125001972025Encapsulant-defined Land Grid Array (LGA) Package and Method for Making the Same
Deca Technologies USA, Inc.
0 cites - US125001982025Quad Flat No-lead (QFN) Package with Tie Bars and Direct Contact Interconnect Build-up Structure and Method for Making the Same
Deca Technologies USA, Inc.
0 cites - US124380652025Fully Molded Semiconductor Structure with Through Silicon via (TSV) Vertical Interconnects
Deca Technologies USA, Inc.
0 cites - US124245272025Multi-chip or Multi-chiplet Fan-out Device for Laminate and Leadframe Packages
Deca Technologies USA, Inc.
0 cites - US123811542025Fully Molded Bridge Interposer and Method of Making the Same
Deca Technologies USA, Inc.
0 cites - US123005612025Fully Molded Structure with Multi-height Components Comprising Backside Conductive Material and Method for Making the Same
Deca Technologies USA, Inc.
0 cites - US121702612024Molded Direct Contact Interconnect Structure Without Capture Pads and Method for the Same
Deca Technologies USA, Inc.
0 cites - US120573732024Stackable Fully Molded Semiconductor Structure with Through Silicon via (TSV) Vertical Interconnects and Method of Making the Same
Deca Technologies USA, Inc.
0 cites - US119730512024Molded Direct Contact Interconnect Structure Without Capture Pads and Method for the Same
Deca Technologies USA, Inc.
0 cites - US117495342023Quad Flat No-lead (QFN) Package Without Leadframe and Direct Contact Interconnect Build-up Structure and Method for Making the Same
Deca Technologies USA, Inc.
0 cites - US117282482023Fully Molded Semiconductor Structure with Through Silicon via (TSV) Vertical Interconnects
Deca Technologies USA, Inc.
0 cites - US116643212023Multi-step High Aspect Ratio Vertical Interconnect and Method of Making the Same
Deca Technologies USA, Inc.
0 cites - US116160032023Stackable Fully Molded Semiconductor Structure with Through Silicon via (TSV) Vertical Interconnects
Deca Technologies USA, Inc.
0 cites