Chunghyo Jung

5 Patents

• US125895682026

  Method for Producing Injection-molded Article and Electronic Device Comprising Injection-molded Article

  Samsung Electronics Co., Ltd.

  0 cites
• US125404022026

  Electronic Device Including Outer Housing Plated with Conductive Member and Manufacturing Method Therefor

  INTOPS. CO., Ltd

  0 cites
• US118006322023

  Electronic Device Having Heat-radiating Structure

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US116276542023

  Electronic Device Including Heat Dissipation Structure

  Samsung Electronics Co., Ltd.

  0 cites
• US115556572023

  Electronic Device Having Heat Collection/diffusion Structure

  Samsung Electronics Co., Ltd.

  0 cites