Chung-yu Lu

6 Patents

• US123745992025

  Package Structure Comprising a Semiconductor Die with Thermoelectric Elements and Manufacturing Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US121130272024

  Three-dimensional Integrated Circuit Structures and Methods of Forming the Same

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US119159942024

  Package Structure Comprising a Semiconductor Die with a Thermoelectric Structure and Manufacturing Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US119013062024

  Semiconductor Structure

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US118107932023

  Semiconductor Packages and Methods of Forming Same

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US117282782023

  Board Substrates, Three-dimensional Integrated Circuit Structures and Methods of Forming the Same

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites