12 Patents
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- US124007952025Multilayer Electronic Component Having External Electrode Including Alloy Layer Between Base Electrode Layer and Plating Layer
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US123744972025Multilayer Electronic Component with Improved Reliability
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US123548032025Multilayer Electronic Component Having Structure for Improved Adhesion Force and Moisture Protection
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US122550222025Multilayer Electronic Component Having Insulating Layer Which Includes Fluorine-based Organic Material
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US120624972024Capacitor Component Having Protective Layer Which Includes Oxide Ceramic and Metal
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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