Patents/Inventors

Chung-sung Chiang

KaohsiungTW2 patents

3 Patents

US122438392025
Bonded Semiconductor Structure Utilizing Concave/convex Profile Design for Bonding Pads
UNITED MICROELECTRONICS Corp.
0 cites
US119358542024
Method for Forming Bonded Semiconductor Structure Utilizing Concave/convex Profile Design for Bonding Pads
UNITED MICROELECTRONICS Corp.
0 cites
US116409492023
Bonded Semiconductor Structure Utilizing Concave/convex Profile Design for Bonding Pads
UNITED MICROELECTRONICS Corp.
0 cites