Patents/Inventors

Chung Kwang Christopher Tan

Chandler, AZUS6 patents

7 Patents

US123549632025
Lithographic Cavity Formation to Enable EMIB Bump Pitch Scaling
Intel Corporation
0 cites
US123344432025
Lithographic Cavity Formation to Enable EMIB Bump Pitch Scaling
Intel Corporation
0 cites
US122305632025
Method to Enable 30 Microns Pitch EMIB or Below
Intel Corporation
0 cites
US121762232024
Integrated Circuit Package Supports
Intel Corporation
0 cites
US119293302024
Lithographic Cavity Formation to Enable EMIB Bump Pitch Scaling
Intel Corporation
0 cites
US118548342023
Integrated Circuit Package Supports
Intel Corporation
0 cites
US116768912023
Method to Enable 30 Microns Pitch EMIB or Below
Intel Corporation
0 cites