Patents/Inventors

Chung-jung Wu

HsinchuTW17 patents

12 Patents

US126222712026
Cooling Cover and Packaged Semiconductor Device Including the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US125001082025
Bonding System and Method
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124451292025
Proximity Detection Method and Circuit Thereof
Sensortek Technology Corp.
0 cites
US124169512025
Electronic Device Including a Movably Connected Bezel
Wistron Corp.
0 cites
US123410812025
Semiconductor Device and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119963512024
Packaged Semiconductor Device Including Liquid-cooled Lid and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US119554052024
Semiconductor Package Including Thermal Interface Structures and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US119012632024
Semiconductor Device and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118113982023
Capacitance Sensing Device Operation Method
Sensortek Technology Corp
0 cites
US116999962023
Method for Proximity Sensing and Applied Electronic Device Thereof
Sensortek Technology Corp.
0 cites
US116316292023
Semiconductor Device and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US115691472023
Method of Forming Semiconductor Package with Composite Thermal Interface Material Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites