Chung-hung Lai

3 Patents

• US118550342023

  Electronic Device Package and Method of Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US117989072023

  Semiconductor Packages

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US116212172023

  Substrate Structure and Semiconductor Package Structure

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites