69 Patents
- US125638152026Semiconductor Structure Having First Silicide Features and Second Silicide Features and Method for Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US125573392026Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US125507012026Formation Method of Semiconductor Device with Stacked Conductive Structures
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US125433642026Integrated Circuit with Backside Metal Gate Cut for Reduced Coupling Capacitance
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US125385102026Semiconductor Device and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US125325052026Semiconductor Structure and Method for Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US125325092026Integrated Circuit with Backside Trench for Nanosheet Removal
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US125074382025Semiconductor Structure with Contact Rail and Method for Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US124842542025Integrated Circuit Structure with Backside via Rail
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124713152025Semiconductor Device Including Spacers on Sides of Dielectric Structure and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US124577942025Dual Side Contact Structures for Source/drain Regions in Semiconductor Transistor Devices and Method of Forming
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US124380422025High Capacitance MIM Device with Self Aligned Spacer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US124329752025Semiconductor Device with Backside Power Rail
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US123827092025Semiconductor Device Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US123763562025Semiconductor Devices with Backside Power Rail and Methods of Fabrication Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US123639642025Semiconductor Device Having Dielectric Hybrid Fin
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US123565832025Heat Dissipation Module and Electronic Device
Nanning Fulian Fugui Precision Industrial Co., Ltd.
0 cites - US123566882025Method for Forming Semiconductor Device
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123477482025Semiconductor Device and Method of Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US122782732025Semiconductor Device with Backside Gate Isolation Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US122726342025Semiconductor Structure Having an Anchor-shaped Backside Via
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US122665662025Contact Resistance Between via and Conductive Line
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US122666582025Semiconductor Devices with Backside Contacts and Isolation
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US122667002025Semiconductor Nanostructures Device Structure with Backside Contact
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US122611962025Metal-insulator-metal Device Capacitance Enhancement
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122438232025Semiconductor Device Having Backside Gate Contact
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US122439072025Multi-layer Trench Capacitor Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US122242122025Semiconductor Devices with Backside Air Gap Dielectric
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US122118762025Extra Doped Region for Back-side Deep Trench Isolation
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US121487822024Composite BSI Structure and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121488052024Semiconductor Structure with Wraparound Backside Amorphous Layer
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US121258522024Multi-gate Transistors with Backside Power Rail and Reduced Gate-drain Capacitance
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US121070112024Method for Fabricating a Semiconductor Device
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120949732024Semiconductor Devices with Backside Power Rail and Methods of Fabrication Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120573412024Semiconductor Device with Gate Cut Structure and Method of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120465162024Semiconductor Device with Gate Cut Feature and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120092542024Contact Resistance Between via and Conductive Line
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - 0 cites
- US119843532024High Capacitance MIM Device with Self Aligned Spacer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119844652024Multiple Deep Trench Isolation (MDTI) Structure for CMOS Image Sensor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119787732024Formation Method of Semiconductor Device Structure with Semiconductor Nanostructures
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119555152024Dual Side Contact Structures in Semiconductor Devices
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - 0 cites
- US119425302024Semiconductor Devices with Backside Power Rail and Methods of Fabrication Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119161002024Multi-layer Trench Capacitor Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US119014282024Semiconductor Device with Backside Gate Isolation Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US118483722023Method and Structure for Reducing Source/drain Contact Resistance at Wafer Backside
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US118044862023Backside Power Rail and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US117913572023Composite BSI Structure and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117842332023Integrated Circuit Structure with Backside via Rail
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US117770032023Semiconductor Structure with Wraparound Backside Amorphous Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117696962023Method for Fabricating a Semiconductor Device
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US117499502023Shielding Housing Structure of Electric Connector with Features for Heat Ventilation and Electromagnetic Shielding
ACES ELECTRONICS CO., Ltd.
0 cites - US117283662023Extra Doped Region for Back-side Deep Trench Isolation
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US117107422023Semiconductor Devices with Backside Contacts and Isolation
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US116642802023Semiconductor Devices with Backside Air Gap Dielectric
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - 0 cites
- 0 cites
- US116316382023Semiconductor Structure Having an Anchor-shaped Backside Via
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US116211972023Semiconductor Device with Gate Cut Feature and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US116161432023Semiconductor Devices with Backside Power Rail and Methods of Fabrication Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US115498052023Projecting Apparatus and Projecting Calibration Method
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
0 cites