Chun-te Lee

7 Patents

• US124565782025

  Metal Electrode of Ceramic Capacitor and Method of Forming the Same

  NATIONAL CHENG KUNG UNIVERSITY

  0 cites
• US124566732025

  Flip Chip Package and Substrate Thereof

  CHIPBOND TECHNOLOGY CORPORATION

  0 cites
• US124328492025

  Flip-chip Bonding Structure and Circuit Board Thereof

  CHIPBOND TECHNOLOGY CORPORATION

  0 cites
• US120893262024

  Double-sided Flexible Circuit Board

  CHIPBOND TECHNOLOGY CORPORATION

  0 cites
• US117929232023

  Storage Device for Flexible Circuit Packages and Carrier Thereof

  CHIPBOND TECHNOLOGY CORPORATION

  0 cites
• US117640902023

  Tray

  CHIPBOND TECHNOLOGY CORPORATION

  0 cites
• US116020472023

  Circuit Board Tape and Joining Method Thereof

  CHIPBOND TECHNOLOGY CORPORATION

  0 cites