Chun-te Ho

3 Patents

• US124446872025

  Interconnect Structure with Vias Extending Through Multiple Dielectric Layers

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US119015542024

  Anode Material for Secondary Battery, Anode for Secondary Battery and Secondary Battery

  National Tsing Hua University

  0 cites
• US118945562024

  Anode Material for Secondary Battery, Anode for Secondary Battery and Secondary Battery

  National Tsing Hua University

  0 cites