Chun-jung Lin

5 Patents

• US125688472026

  Chip Package and Method of Manufacturing the Same

  WALTON ADVANCED ENGINEERING, Inc.

  0 cites
• US125327602026

  Chip Package Unit, Method of Manufacturing the Same, and Package Structure Formed by Stacking the Same

  WALTON ADVANCED ENGINEERING, Inc.

  0 cites
• US125124482025

  Multi-layer Stacked Chip Package

  WALTON ADVANCED ENGINEERING, Inc.

  0 cites
• US124827712025

  Chip Package with Higher Bearing Capacity in Wire Bonding

  WALTON ADVANCED ENGINEERING, Inc.

  0 cites
• US119993522024

  Method and System for Extracting Road Data and Method and System for Controlling Self-driving Car

  INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

  0 cites