Patents/Inventors

Chun-i Tsai

HsinchuTW14 patents

14 Patents

US125882682026
Liner-free Conductive Structures
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US124008532025
Method of Forming Conductive Feature Including Cleaning Step
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123277882025
Gate to Source Drain Interconnects
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121486592024
Contact Conductive Feature Formation and Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120573972024
Capping Layer for Liner-free Conductive Structures
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120209812024
Conductive Feature Formation and Structure
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US119553292024
Method of Forming Conductive Feature Including Cleaning Step
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US119553792024
Metal Adhesion Layer to Promote Metal Plug Adhesion
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119293142024
Interconnect Structures Including a Fin Structure and a Metal Cap
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118173842023
Interconnect Structure and Manufacturing Method for the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US117988432023
Conductive Feature Formation and Structure
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US116768592023
Contact Conductive Feature Formation and Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116704992023
Method of Forming Conductive Feature Including Cleaning Step
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US115946092023
Liner-free Conductive Structures
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites