7 Patents
- US121548662024Method of Fabricating a Flip-chip Package Core Substrate with Build-up Layers
PHOENIX PIONEER TECHNOLOGY CO., Ltd.
0 cites - US120949222024Inductance Traces Protected Through Shielding Layers
PHOENIX PIONEER TECHNOLOGY CO., Ltd.
0 cites - US118872992024Image Processing System and Image Processing Method
NATIONAL TAIWAN UNIVERSITY HOSPITAL
0 cites - US117912812023Package Substrate and Method for Manufacturing the Same
PHOENIX PIONEER TECHNOLOGY CO., Ltd.
0 cites - 0 cites
- US117496192023Package Substrate and Method for Manufacturing the Same
PHOENIX PIONEER TECHNOLOGY CO., Ltd.
0 cites - 0 cites