10 Patents
- US123277342025Chemical Mechanical Polish Slurry and Method of Manufacture
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US122495422025Semiconductor Device Structure with an Interconnect Structure in a Dielectric Layer with Multiple Hydrophobic Layers Along Sidewalls of the Dielectric Layer, and Method for Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US120366362024Mega-sonic Vibration Assisted Chemical Mechanical Planarization
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119643582024Chemical Mechanical Polishing Apparatus and Method
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US118548272023Magnetic Slurry for Highly Efficiency CMP
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US118548722023Semiconductor Device Structure with Interconnect Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US115906272023Mega-sonic Vibration Assisted Chemical Mechanical Planarization
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites