Patents/Inventors

Chun-chieh Lin

Hsinchu CityTW31 patents

25 Patents

USD11216122026
Wearable Device Body
TAIWAN-ASIA SEMICONDUCTOR CORPORATION
0 cites
USD11197972026
Sensing Module
Taiwan-asia Semiconductor Corporation
0 cites
US125819252026
Selective Metal Cap in an Interconnect Structure
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US125576292026
Interconnect Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
USD11076952025
Wearable Device Body
TAIWAN-ASIA SEMICONDUCTOR CORPORATION
0 cites
USD10998572025
Photodiode
TAIWAN-ASIA SEMICONDUCTOR CORPORATION
0 cites
USD10966772025
Photodiode
TAIWAN-ASIA SEMICONDUCTOR CORPORATION
0 cites
US123158092025
Via for Semiconductor Device and Method
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US122207262025
Silicide Capacitive Micro Electromechanical Structure and Fabrication Method Thereof
TAIWAN-ASIA SEMICONDUCTOR CORPORATION
0 cites
US121788172024
Compounds for Enhancing Pparγ Expression and Nuclear Translocation and Therapeutic Use Thereof
REALINN LIFE SCIENCE LIMITED
0 cites
US121722632024
Chemical Mechanical Planarization Tool
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121680092024
Modulators of Cystic Fibrosis Transmembrane Conductance Regulator
Vertex Pharmaceuticals Incorporated
0 cites
US121701952024
Post-cmp Cleaning and Apparatus
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121545152024
Displays with Reduced Temperature Luminance Sensitivity
Apple Inc.
0 cites
US120947702024
Ruthenium-based Liner for a Copper Interconnect
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120805942024
Thermally Stable Copper-alloy Adhesion Layer for Metal Interconnect Structures and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US120026842024
Methods for Chemical Mechanical Polishing and Forming Interconnect Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US119086972024
Interconnect Structure Having a Carbon-containing Barrier Layer
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
0 cites
US118108572023
Via for Semiconductor Device and Method
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US117722282023
Chemical Mechanical Polishing Apparatus Including a Multi-zone Platen
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US117281572023
Post-cmp Cleaning and Apparatus
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116794692023
Chemical Mechanical Planarization Tool
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116768982023
Diffusion Barrier for Semiconductor Device and Method
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US116603452023
Method and Composition for Enhancing the Delivery of Anti-platelet Drugs for the Treatment of Acute Stroke
REALINN LIFE SCIENCE LIMITED
0 cites
US116580652023
Chemical Mechanical Polishing Slurry Composition, Method for Chemical Mechanical Polishing and Method for Forming Connecting Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites