Patents/Inventors

Chun-chieh Chuang

TainanTW4 patents

5 Patents

US124762242025
3DIC Interconnect Apparatus and Method
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123006702025
Hybrid Bond Pad Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118044732023
Hybrid Bond Pad Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117989162023
3DIC Interconnect Apparatus and Method
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US115968002023
Interconnect Structure and Method of Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites