8 Patents
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- US123158182025Interconnection Structure of a Semiconductor Chip Having Pads of Different Widths and Semiconductor Package Including the Interconnection Structure
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US122242582025Semiconductor Chip and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US120210552024Semiconductor Package and Method for Manufacturing Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US119232862024Package Substrate and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US118240232023Semiconductor Chip and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- US116263702023Interconnection Structure of a Semiconductor Chip and Semiconductor Package Including the Interconnection Structure
SAMSUNG ELECTRONICS CO., Ltd.
0 cites