Patents/Inventors

Chuei-tang Wang

Taichung CityTW75 patents

72 Patents

US125990092026
Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US125882222026
Semiconductor Package Including an Integrated Circuit Die and an Inductor or a Transformer
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US125608292026
Photonic Semiconductor Device and Method
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US125469352026
Integrated Circuit Package and Method of Forming Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US125388512026
Memory Packages and Methods of Forming Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US125124052025
Semiconductor Package and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US125124242025
Package, Package Structure and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US125045882025
Semiconductor Device and Methods of Manufacture
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US124890622025
Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124698082025
Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124179912025
Chip Stack Structure with Conductive Plug and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US124127992025
Integrated Circuit Package and Method
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US124128522025
Polymer Layers Embedded with Metal Pads for Heat Dissipation
Taiwan Semiconductor Manufacturing Company, Ltd.
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US123459352025
Package Assembly and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Co., Ltd.
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US123411062025
Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123344572025
Integrated Fan-out Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123277962025
Architecture for Computing System Package
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123226912025
Package Structure and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123227052025
Chip Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123158542025
Integrated Circuit Package and Method
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123005752025
Semiconductor Package and Method
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US122782142025
Integrated Circuit Package and Method
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122726162025
Heat-dissipating Structures for Semiconductor Devices and Methods of Manufacture
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US122726912025
Semiconductor and Circuit Structures, and Related Methods
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US122666732025
Semiconductor Package and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122180062025
System, Device and Methods of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US121912702025
Integrated Circuit Package and Method of Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US121744152024
Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121659522024
Interposer Directly Bonded to Bonding Pads on a Plurality of Dies
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121365932024
Electronic Apparatus Including Antennas and Directors
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121257982024
Semiconductor Package and Method
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US121258122024
Integrated Circuit Packages and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121258242024
Semiconductor Stack Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121006982024
Semiconductor Device and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120948602024
Package Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120877572024
Integrated Circuit Packages
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US120806842024
Die Stacks and Methods Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120682952024
Deep Partition Power Delivery with Deep Trench Capacitor
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US120574072024
Semiconductor Package and Method
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US120516492024
Architecture for Computing System Package
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US120464802024
Manufacturing Method of a Semiconductor Device
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US120402812024
Semiconductor Package Structure Comprising Rigid-flexible Substrate and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120405662024
Antenna Device
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US120339632024
Package Structure Comprising Thermally Conductive Layer Around the IC Die
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120210472024
Semiconductor Packages Having a Die, an Encapsulant, and a Redistribution Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119846682024
Method of Embedding Low-k Materials in Antennas
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119489262024
Integrated Circuit Package and Method
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US119293332024
Integrated Fan-out Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119233152024
Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119087872024
Package Structure and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118549282023
Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118550462023
Memory Packages and Methods of Forming Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118482352023
System, Device and Methods of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US118415412023
Package Assembly and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118308412023
Semiconductor Package and Method for Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US118308642023
Photonic Semiconductor Device and Method
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US117841722023
Deep Partition Power Delivery with Deep Trench Capacitor
TAIWAN SEMICONDUCTOR MANUFACTURING HSINCHU, CO., Ltd.
0 cites
US117769052023
Package Structure, Package-on-package Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117697312023
Architecture for Computing System Package
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd
0 cites
US117648232023
Method of Using Integrated Transmitter and Receiver Front End Module
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US117355762023
Integrated Circuit Package and Method
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US117283272023
Integrated Circuit Package and Method
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US116825832023
Through-vias and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116769062023
Chip Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US116463132023
Semiconductor and Circuit Structures, and Related Methods
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US116370972023
Method of Manufacturing Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US116316582023
Under-bump-metallization Structure and Redistribution Layer Design for Integrated Fan-out Package with Integrated Passive Device
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116212442023
Integrated Circuit Package and Method
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116056222023
Photonic Semiconductor Device and Method
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY. Ltd.
0 cites
US116004312023
Info Coil on Metal Plate with Slot
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US115879162023
Package Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US115629262023
Package Structure and Method of Forming Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites