13 Patents
- US125754322026Chip Fine Line Fan-out Package Structure and Manufacturing Method Therefor
Shenzhen Xiuyuan Electronic Technology Co., Ltd.
0 cites - US125062522025Fan-out Package Structure and Fabrication Method Therefor
Institute Of Semiconductors, Guangdong Academy Of Sciences
0 cites - 0 cites
- US121842532024Filter Radio Frequency Module Packaging Structure and Method for Manufacturing Same
Institute Of Semiconductors, Guangdong Academy Of Sciences
0 cites - US121129562024Chip Interconnection Package Structure and Method
Institute Of Semiconductors, Guangdong Academy Of Sciences
0 cites - US118748822024Extracting Key Phrase Candidates from Documents and Producing Topical Authority Ranking
Microsoft Technology Licensing, LLC
0 cites - US118698722024Chip Stack Packaging Structure and Chip Stack Packaging Method
Institute Of Semiconductors, Guangdong Academy Of Sciences
0 cites - US117831682023Network Accuracy Quantification Method and System, Device, Electronic Device and Readable Medium
LYNXI TECHNOLOGIES CO., Ltd.
0 cites - US117846252023Packaging Method and Package Structure for Filter Chip
GUANGDONG INSTITUTE OF SEMICONDUCTOR INDUSTRIAL TECHNOLOGY
0 cites - 0 cites
- US117106462023Fan-out Packaging Method and Fan-out Packaging Plate
SHENZHEN XIUYI INVESTMENT DEVELOPMENT PARTNERSHIP (LIMITED PARTNERSHIP)
0 cites - 0 cites
- US116096722023Touch Control Substrate and Preparation Method Thereof, Touch Control Module and Display Device
Institute Of Semiconductors, Guangdong Academy Of Sciences
0 cites