Patents/Inventors

Chuan-an Cheng

Zhubei CityTW2 patents

3 Patents

US126108712026
Through-dielectric Vias for Direct Connection and Method Forming Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US121258202024
Through-dielectric Vias for Direct Connection and Method Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US117216632023
Multi-level Stacking of Wafers and Chips
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites