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Christopher Pelto
Beaverton, OR
US
3 patents
3 Patents
US12469801
2025
Moisture Seal Coating of Hybrid Bonded Stacked Die Package Assembly
Intel Corporation
0 cites
US12436467
2025
Simulating Die Rotation to Minimize Area Overhead of Reticle Stitching for Stacked Dies
Intel Corporation
0 cites
US12431441
2025
Interlayer Dielectric Stack Optimization for Wafer Bow Reduction
Intel Corporation
0 cites