Patents/Inventors

Christopher Jezewski

Portland, ORUS15 patents

15 Patents

US125989772026
Fill of Vias in Single and Dual Damascene Structures Using Self-assembled Monolayer
Intel Corporation
0 cites
US124827442025
Subtractively Patterned Interconnect Structures for Integrated Circuits
Intel Corporation
0 cites
US123947162025
Integrated Circuit Interconnect Structures with Graphene Cap
Intel Corporation
0 cites
US122117942025
Integrated Circuits and Methods for Forming Thin Film Crystal Layers
Intel Corporation
0 cites
US121659172024
Integrated Circuit Interconnect Structures with Ultra-thin Metal Chalcogenide Barrier Materials
Intel Corporation
0 cites
US121070852024
Interconnect Techniques for Electrically Connecting Source/drain Regions of Stacked Transistors
Intel Corporation
0 cites
US121071702024
Transistor Channel Passivation with 2D Crystalline Material
Intel Corporation
0 cites
US120274582024
Subtractively Patterned Interconnect Structures for Integrated Circuits
Intel Corporation
0 cites
US118880342024
Transistors with Metal Chalcogenide Channel Materials
Intel Corporation
0 cites
US118307882023
Integrated Circuits and Methods for Forming Integrated Circuits
Intel Corporation
0 cites
US117495602023
Cladded Metal Interconnects
Intel Corporation
0 cites
US117423462023
Interconnect Techniques for Electrically Connecting Source/drain Regions of Stacked Transistors
Intel Corporation
0 cites
US116705882023
Selectable Vias for Back End of Line Interconnects
Intel Corporation
0 cites
US116643052023
Staggered Lines for Interconnect Performance Improvement and Processes for Forming Such
Intel Corporation
0 cites
US116371852023
Contact Stacks to Reduce Hydrogen in Semiconductor Devices
Intel Corporation
0 cites