Patents/Inventors

Christopher Daniel Manack

Flower Mound, TXUS26 patents

24 Patents

US125124162025
Laser Ablation for Die Separation to Reduce Laser Splash and Electronic Device
TEXAS INSTRUMENTS INCORPORATED
0 cites
US123946712025
Efficient Removal of Street Test Devices During Wafer Dicing
TEXAS INSTRUMENTS INCORPORATED
0 cites
US122551152025
Electronic Devices in Semiconductor Package Cavities
TEXAS INSTRUMENTS INCORPORATED
0 cites
US122372192025
Contact with Bronze Material to Mitigate Undercut
TEXAS INSTRUMENTS INCORPORATED
0 cites
US122037762025
Miniature Sensor Cavities
TEXAS INSTRUMENTS INCORPORATED
0 cites
US121425862024
Efficient Redistribution Layer Topology
TEXAS INSTRUMENTS INCORPORATED
0 cites
US121006782024
Conductive Members for Die Attach in Flip Chip Packages
TEXAS INSTRUMENTS INCORPORATED
0 cites
US120740962024
Die Attach Surface Copper Layer with Protective Layer for Microelectronic Devices
TEXAS INSTRUMENTS INCORPORATED
0 cites
US120682212024
Plating for Thermal Management
TEXAS INSTRUMENTS INCORPORATED
0 cites
US120625972024
Three Dimensional Package for Semiconductor Devices and External Components
TEXAS INSTRUMENTS INCORPORATED
0 cites
US120093192024
Integrated Circuit with Metal Stop Ring Outside the Scribe Seal
TEXAS INSTRUMENTS INCORPORATED
0 cites
US119844182024
Method of Forming Brass-coated Metals in Flip-chip Redistribution Layers
TEXAS INSTRUMENTS INCORPORATED
0 cites
US119787092024
Integrated System-in-package with Radiation Shielding
TEXAS INSTRUMENTS INCORPORATED
0 cites
US119423862024
Electronic Devices in Semiconductor Package Cavities
TEXAS INSTRUMENTS INCORPORATED
0 cites
US118698202024
IC Having a Metal Ring Thereon for Stress Reduction
TEXAS INSTRUMENTS INCORPORATED
0 cites
US118549222023
Semicondutor Package Substrate with Die Cavity and Redistribution Layer
Texas Instruments Incorporated
0 cites
US118550242023
Wafer Chip Scale Packages with Visible Solder Fillets
Texas Instruments Incorporated
0 cites
US118375182023
Coated Semiconductor Dies
Texas Instruments Incorporated
0 cites
US116642762023
Front Side Laser-based Wafer Dicing
Texas Instruments Incorporated
0 cites
US116316322023
Three Dimensional Package for Semiconductor Devices and External Components
Texas Instruments Incorporated
0 cites
US116160382023
Interconnect for Electronic Device
TEXAS INSTRUMENTS INCORPORATED
0 cites
US115945042023
Nickel Alloy for Semiconductor Packaging
TEXAS INSTRUMENTS INCORPORATED
0 cites
US115878582023
Zinc-cobalt Barrier for Interface in Solder Bond Applications
TEXAS INSTRUMENTS INCORPORATED
0 cites
US115629492023
Semiconductor Package Including Undermounted Die with Exposed Backside Metal
TEXAS INSTRUMENTS INCORPORATED
0 cites