3 Patents
- US124041702025Method for Producing a Bonding Pad for a Micromechanical Sensor Element
ROBERT BOSCH GmbH
0 cites - US120947172024Method for Forming a Trench in a First Semiconductor Layer of a Multi-layer System
ROBERT BOSCH GmbH
0 cites - US120318202024Micromechanical System, Method for Operating a Micromechanical System
ROBERT BOSCH GmbH
0 cites