Patents/Inventors

Christian Beyer

FreibergDE14 patents

14 Patents

USRE0508092026
Method of Modifying a Solid Using Laser Light
Siltectra GmbH
0 cites
US123567002025
Method for Splitting Semiconductor Wafers
Infineon Technologies AG
0 cites
US122866112025
Tissue Culture Vessel for Preparation of Compressed Hydrogel Skin Grafts and Related Methods and Systems
Cutiss AG
0 cites
US122117022025
Solid Body and Multi-component Arrangement
Siltectra GmbH
0 cites
US121598052024
Method for Producing Wafers with Modification Lines of Defined Orientation
Siltectra GmbH
0 cites
US121513142024
Device and Method for Applying Pressure to Stress-producing Layers for Improved Guidance of a Separation Crack
Siltectra GmbH
0 cites
US120976412024
Method for Forming a Crack in an Edge Region of a Donor Substrate
Siltectra GmbH
0 cites
US120302162024
Method for Separating Wafers from Donor Substrates
Siltectra GmbH
0 cites
US119963312024
Method for Separating a Solid Body
Siltectra GmbH
0 cites
US119086522024
Signaling Device, an Electrical Fuse Apparatus and a Device Comprising the Electrical Fuse Apparatus
SCHURTER AG
0 cites
US118698102024
Method for Reducing the Thickness of Solid-state Layers Provided with Components
Siltectra GmbH
0 cites
US118336172023
Splitting of a Solid Using Conversion of Material
Siltectra GmbH
0 cites
US117870832023
Production Facility for Separating Wafers from Donor Substrates
Siltectra GmbH
0 cites
US116996162023
Method for Producing a Layer of Solid Material
Siltectra GmbH
0 cites