Patents/Inventors

Choongbin Yim

Suwon-siKR19 patents

11 Patents

US126223022026
Semiconductor Package Including a Lower Substrate and an Upper Substrate
Samsung Electronics Co., Ltd.
0 cites
US125754382026
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US125123982025
Semiconductor Package Having Semiconductor Chip Positioned in Cavity of Cover Wiring Structure
Samsung Electronics Co., Ltd.
0 cites
US124246012025
Semiconductor Package and Manufacturing Method Thereof
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123880292025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121487292024
Semiconductor Package Structure Having Interposer Substrate, and Stacked Semiconductor Package Structure Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120210362024
Semiconductor Package Including Interposer and Method of Manufacturing the Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118549892023
Semiconductor Package Substrate and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117988892023
Methods of Manufacturing Semiconductor Packages
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117106732023
Interposer and Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
0 cites
US115812632023
Semiconductor Package, and Package on Package Having the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites