3 Patents
- US123745582025Laser-assisted Bonding Apparatus for Bonding an Electronic Device to a Substrate
Amkor Technology Singapore Holding Ptd. Ltd.
0 cites - US117496372023Hybrid Bonding Interconnection Using Laser and Thermal Compression
Amkor Technology Singapore Holding Pte. Ltd.
0 cites - US117422162023System and Method for Laser Assisted Bonding of an Electronic Device
Amkor Technology Singapore Holding Pte. Ltd.
0 cites