Patents/Inventors

Chonghui Sun

HangzhouCN2 patents

2 Patents

US125627722026
Magnetic Coupling-based Inter-chip Wireless Communication Interface Structure and Method for Three-dimensional Stacked Chips
JCET GROUP CO., Ltd.
0 cites
US123683242025
Inductive Coupling System and Method for Adaptive Control of Power Transfer for Wireless Three-dimensional Stacked Chip Package
JCET GROUP CO., Ltd.
0 cites