Chong Leong Gan

5 Patents

• US125820142026

  Semiconductor Device Assembly Substrates with Tunneled Interconnects, and Methods for Making the Same

  Micron Technology, Inc.

  0 cites
• US125576792026

  Methods and Apparatus for Using Epoxy-based or Ink-based Spacer to Support Large Die in Semiconductor Devices

  Micron Technology, Inc.

  0 cites
• US125327752026

  Methods and Assemblies for Measurement and Prediction of Package and Die Strength

  Micron Technology, Inc.

  0 cites
• US124245652025

  Radiation Protection for Semiconductor Devices and Associated Systems and Methods

  Micron Technology, Inc.

  0 cites
• US122181032025

  Radiation Hardened Semiconductor Devices and Packaging

  Micron Technology, Inc.

  0 cites