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Ching-yu Ni
New Taipei
TW
2 patents
3 Patents
US12174170
2024
Biochip Packaging Structure
Kore Semiconductor Co., Ltd.
0 cites
US11581260
2023
Package Structure and Manufacturing Method Thereof
Kore Semiconductor Co., Ltd.
0 cites
US11569195
2023
Semiconductor Packaging Structure and Method of Fabricating Same
Kore Semiconductor Co., Ltd.
0 cites