Patents/Inventors

Ching-yang Wen

SingaporeSG11 patents

11 Patents

US125573092026
Semiconductor Package Structure
UNITED MICROELECTRONICS Corp.
0 cites
US123241682025
Semiconductor Device and Manufacturing Method Thereof
United Microelectronics Corp.
0 cites
US123005342025
Method of Forming Protective Layer Utilized in Silicon Remove Process
UNITED MICROELECTRONICS Corp.
0 cites
US121911952025
Method of Fabricating an Air Gap
UNITED MICROELECTRONICS Corp.
0 cites
US120806222024
Semiconductor Structure and Method of Wafer Bonding
UNITED MICROELECTRONICS Corp.
0 cites
US119552922024
Parallel-connected Trench Capacitor Structure with Multiple Electrode Layers and Method of Fabricating the Same
UNITED MICROELECTRONICS Corp.
0 cites
US119292132024
Parallel-connected Trench Capacitor Structure with Multiple Electrode Layers and Method of Fabricating the Same
UNITED MICROELECTRONICS Corp.
0 cites
US119233732024
Semiconductor Structure
UNITED MICROELECTRONICS Corp.
0 cites
US118815292024
Semiconductor Device and Method of Fabricating the Same
UNITED MICROELECTRONICS Corp.
0 cites
US117157092023
Manufacturing Method of Radiofrequency Device Including Mold Compound Layer
UNITED MICROELECTRONICS Corp.
0 cites
US116705672023
Semiconductor Structure and Method of Wafer Bonding
UNITED MICROELECTRONICS Corp.
0 cites