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Inventors
Ching-wen Liu
Taoyuan
TW
3 patents
3 Patents
US12532440
2026
Heat Dissipation Structure and Power Module
ACTRON TECHNOLOGY CORPORATION
0 cites
US12408281
2025
Circuit Substrate and Electronic Device
ACTRON TECHNOLOGY CORPORATION
0 cites
US11810835
2023
Intelligent Power Module Packaging Structure
ACTRON TECHNOLOGY CORPORATION
0 cites