Ching-tien Su

2 Patents

• US124698062025

  Semiconductor Structure Having Dielectric Plugs Penetrating Through a Polymer Layer

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US116706092023

  Method for Manufacturing a Semiconductor Device Including Patterning a Polymer Layer to Reduce Stress

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites