Patents/Inventors

Ching I Li

TainanTW26 patents

25 Patents

US125817622026
Enhanced Trench Isolation Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US125573912026
Method for Forming Semiconductor-on-insulator (SOI) Substrate and Recycle Substrate
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US125576102026
Multilayer Isolation Structure for High Voltage Silicon-on-insulator Device
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US125327282026
Backside Leakage Prevention
AIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US125002062025
Mechanical Wafer Alignment Detection for Bonding Process
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124843272025
Pre-cleaning for a Deep Trench Isolation Structure in a Pixel Sensor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124397092025
Image Sensor with Diffusion Barrier Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
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US124263902025
Passivation for a Vertical Transfer Gate in a Pixel Sensor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124084482025
Deep Trench Isolation Structure and Methods for Fabrication Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123897102025
Full Well Capacity for Image Sensor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123640462025
Photodiode Structure for Image Sensor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123494922025
Photodiode Structure for Image Sensor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123288862025
Metal-insulator-metal Capacitor and Methods of Manufacturing
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122305852025
Photolithography Alignment Process for Bonded Wafers
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122181842025
Semiconductor Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US121256652024
Ion Implantation System
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
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US120741862024
Isolation Epitaxial Bi-layer for Backside Deep Trench Isolation Structure in an Image Sensor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120028132024
Method for Forming Semiconductor-on-insulator (SOI) Substrate by Cleaving a Multilayer Structure Along Voids to Separate a Substrate
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US119160222024
Photolithography Alignment Process for Bonded Wafers
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118697612024
Back-side Deep Trench Isolation Structure for Image Sensor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118174692023
Light Absorbing Layer to Enhance P-type Diffusion for DTI in Image Sensors
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117842042023
Enhanced Trench Isolation Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117217742023
Full Well Capacity for Image Sensor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US116887172023
Mechanical Wafer Alignment Detection for Bonding Process
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US116825782023
Multilayer Isolation Structure for High Voltage Silicon-on-insulator Device
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites