17 Patents
- 0 cites
- US125574052026Structure and Method for Backside-illuminated Image Device
TAIWAN SEMICONDUCTOR MANUFACUTURING COMPANY, Ltd
0 cites - 0 cites
- US123158432025Hybrid Bonding Technology for Stacking Integrated Circuits
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US122611962025Metal-insulator-metal Device Capacitance Enhancement
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122439072025Multi-layer Trench Capacitor Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122118762025Extra Doped Region for Back-side Deep Trench Isolation
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119964332024Pad Structure for Front Side Illuminated Image Sensor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119844652024Multiple Deep Trench Isolation (MDTI) Structure for CMOS Image Sensor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US119161002024Multi-layer Trench Capacitor Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US118944102024Bond Pad Structure for Bonding Improvement
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US117569722023Apparatus for Reducing Optical Cross-talk in Image Sensors
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US117283662023Extra Doped Region for Back-side Deep Trench Isolation
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117054742023Metal Reflector Grounding for Noise Reduction in Light Detector
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites