Chin Wei Tan

3 Patents

• US119292602024

  Low Warpage Curing Methodology by Inducing Curvature

  APPLIED MATERIALS, Inc.

  0 cites
• US118814362024

  Pre and Post Processing Metrology Apparatus

  APPLIED MATERIALS, Inc.

  0 cites
• US118716672024

  Methods and Apparatus for Warpage Correction

  APPLIED MATERIALS, Inc.

  0 cites