Chin-tien Chiu

7 Patents

• US125060482025

  Bifacial Semiconductor Wafer

  Sandisk Technologies, Inc.

  0 cites
• US122242482025

  Semiconductor Wafer and Semiconductor Dies Formed Therefrom Including Grooves Along Long Edges of the Semiconductor Dies

  Sandisk Technologies, Inc.

  0 cites
• US121548602024

  Method of Forming a Semiconductor Device Including Vertical Contact Fingers

  Sandisk Technologies, Inc.

  0 cites
• US120516602024

  Wire Bond Pad Design for Compact Stacked-die Package

  Western Digital Technologies, Inc.

  0 cites
• US119012602024

  Thermoelectric Semiconductor Device and Method of Making Same

  Western Digital Technologies, Inc.

  0 cites
• US117841352023

  Semiconductor Device Including Conductive Bumps to Improve EMI/RFI Shielding

  Western Digital Technologies, Inc.

  0 cites
• US117496472023

  Semiconductor Device Including Vertical Wire Bonds

  Western Digital Technologies, Inc.

  0 cites