Patents/Inventors

Chin-tang Hsieh

KaohsiungTW4 patents

3 Patents

US125435812026
Flip-chip Bonding Structure and Substrate Thereof
CHIPBOND TECHNOLOGY CORPORATION
0 cites
US125388052026
Semiconductor Package and Method of Manufacturing the Same
CHIPBOND TECHNOLOGY CORPORATION
0 cites
US124245512025
Semiconductor Structure and Method of Manufacturing the Same
CHIPBOND TECHNOLOGY CORPORATION
0 cites