9 Patents
- US125506992026Integrated Circuit Interconnect Structure Having Discontinuous Barrier Layer and Air Gap
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US123477762025Integrated Chip with Graphene Based Interconnect
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123005992025Method for Forming Semiconductor Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US122180602025Integrated Chip with Graphene Based Interconnect
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US119786632024Integrated Circuit Interconnect Structure Having Discontinuous Barrier Layer and Air Gap
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US119488372024Semiconductor Structure Having Vertical Conductive Graphene and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US116826162023Semiconductor Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US116055582023Integrated Circuit Interconnect Structure Having Discontinuous Barrier Layer and Air Gap
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites