Patents/Inventors

Chin-kwan Kim

San Diego, CAUS7 patents

8 Patents

US123549352025
Integrated Circuit (IC) Package Substrate with Embedded Trace Substrate (ETS) Layer on a Substrate, and Related Fabrication Methods
QUALCOMM INCORPORATED
0 cites
US123008732025
Antenna Modules Employing a Package Substrate with a Vertically-integrated Patch Antenna(s), and Related Fabrication Methods
QUALCOMM INCORPORATED
0 cites
US122939802025
Package Comprising Discrete Antenna Device
QUALCOMM INCORPORATED
0 cites
US121609522024
Providing a Lower Inductance Path in a Routing Substrate for a Capacitor, and Related Electronic Devices and Fabrication Methods
QUALCOMM INCORPORATED
0 cites
US117768882023
Package with a Substrate Comprising Protruding Pad Interconnects
QUALCOMM INCORPORATED
0 cites
US117644892023
Sub-module L-shaped Millimeter Wave Antenna-in-package
QUALCOMM INCORPORATED
0 cites
US117568942023
Radio-frequency (RF) Integrated Circuit (IC) (RFIC) Packages Employing a Substrate Sidewall Partial Shield for Electro-magnetic Interference (EMI) Shielding, and Related Fabrication Methods
QUALCOMM INCORPORATED
0 cites
US116370572023
Uniform via Pad Structure Having Covered Traces Between Partially Covered Pads
QUALCOMM INCORPORATED
0 cites