Patents/Inventors

Chin Hui Chong

SingaporeSG29 patents

21 Patents

US125937062026
Multi-chip Package with Enhanced Conductive Layer Adhesion
Micron Technology, Inc.
0 cites
US125885272026
Dielectric Interposer with Electrical-connection Cut-in
Micron Technology, Inc.
0 cites
US125640962026
Nested Semiconductor Assemblies and Methods for Making the Same
Micron Technology, Inc.
0 cites
US125327812026
Stacked Capacitors for Semiconductor Devices and Associated Systems and Methods
Micron Technology, Inc.
0 cites
US125124372025
Semiconductor Device Assemblies with Balanced Wires, and Associated Methods
Micron Technology, Inc.
0 cites
US124314182025
Three Dimensional Semiconductor Trace Length Matching and Associated Systems and Methods
Micron Technology, Inc.
0 cites
US124328592025
Surface Mount Device Bonded to an Inner Layer of a Multi-layer Substrate
Micron Technology, Inc.
0 cites
US123622552025
Apparatus Including Direct-contact Heat Paths and Methods of Manufacturing the Same
Micron Technology, Inc.
0 cites
US123623192025
Cross Stack Bridge Bonding Devices and Associated Methods
Micron Technology, Inc.
0 cites
US123549392025
Multi-role Semiconductor Device Substrates, Semiconductor Device Assemblies Employing the Same, and Methods for Forming the Same
Micron Technology, Inc.
0 cites
US123157692025
Build-up Package for Integrated Circuit Devices, and Methods of Making Same
Micron Technology, Inc.
0 cites
US122939922025
Semiconductor Assemblies with Systems and Methods for Managing High Die Stack Structures
Micron Technology, Inc.
0 cites
US122438072025
Substrates for Semiconductor Packages, Including Hybrid Substrates for Decoupling Capacitors, and Associated Devices, Systems, and Methods
Micron Technology, Inc.
0 cites
US122373012025
Through Stack Bridge Bonding Devices and Associated Methods
Micron Technology, Inc.
0 cites
US121487362024
Three-dimensional Bonding Scheme and Associated Systems and Methods
Micron Technology, Inc.
0 cites
US119424602024
Systems and Methods for Reducing the Size of a Semiconductor Assembly
Micron Technology, Inc.
0 cites
US119293512024
Integrated Circuit Wire Bonded to a Multi-layer Substrate Having an Open Area That Exposes Wire Bond Pads at a Surface of the Inner Layer
Micron Technology, Inc.
0 cites
US118942892024
Substrates for Semiconductor Packages, Including Hybrid Substrates for Decoupling Capacitors, and Associated Devices, Systems, and Methods
Micron Technology, Inc.
0 cites
US117231502023
Surface Mount Device Bonded to an Inner Layer of a Multi-layer Substrate
Micron Technology, Inc.
0 cites
US117107222023
Semiconductor Assemblies with Systems and Methods for Managing High Die Stack Structures
Micron Technology, Inc.
0 cites
US115629872023
Semiconductor Devices with Multiple Substrates and Die Stacks
Micron Technology, Inc.
0 cites