9 Patents
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- US122232522025Through-silicon via in Integrated Circuit Packaging
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US121548422024Heat Dissipation Structures for Three-dimensional System on Integrated Chip Structure
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US120275132024Layout Design Methodology for Stacked Devices
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US117569512023Layout Design Methodology for Stacked Devices
Taiwan Semiconductor Manufacturing Co., Ltd.
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- US117156682023Integrated Antenna on Interposer Substrate
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US115867972023Through-silicon Vias in Integrated Circuit Packaging
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites