Chii Shang Hong

9 Patents

• US125123802025

  Semiconductor Packages Including a Package Body with Grooves Formed Therein

  Infineon Technologies AG

  0 cites
• US123344142025

  Power Semiconductor Device with Dual Heat Dissipation Structures

  Infineon Technologies AG

  0 cites
• US120947932024

  Package with Electrically Insulated Carrier and at Least One Step on Encapsulant

  Infineon Technologies AG

  0 cites
• US120806252024

  Semiconductor Package with Releasable Isolation Layer Protection

  Infineon Technologies Austria AG

  0 cites
• US119423832024

  Linear Spacer for Spacing a Carrier of a Package

  Infineon Technologies AG

  0 cites
• US119087712024

  Power Semiconductor Device with Dual Heat Dissipation Structures

  Infineon Technologies AG

  0 cites
• US118760282024

  Package with Electrically Insulated Carrier and at Least One Step on Encapsulant

  Infineon Technologies AG

  0 cites
• US118044242023

  Method for Fabricating a Semiconductor Device by Using Different Connection Methods for the Semiconductor Die and the Clip

  Infineon Technologies Austria AG

  0 cites
• US117912382023

  Semiconductor Package with Releasable Isolation Layer Protection

  Infineon Technologies Austria AG

  0 cites