3 Patents
- US123241052025Maleimide Resin Composition, Prepreg, Resin Film, Laminated Board, Printed Wiring Board, and Semiconductor Package
Resonac Corporation
0 cites - US121687092024Thermosetting Resin Composition, Prepreg, Laminate, Metal-clad Laminate, Printed Wiring Board, and High-speed Communication Compatible Module
RESONAC CORPORATION
0 cites - US120246242024Maleimide Resin Composition, Prepreg, Laminated Board, Resin Film, Printed Wiring Board, and Semiconductor Package
RESONAC CORPORATION
0 cites