Patents/Inventors

Chih-yuan Chiu

Zhudong TownshipTW3 patents

4 Patents

US125061092025
Die Bonding Tool with Tiltable Bond Head for Improved Bonding and Methods for Performing the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US124381182025
Bonding Tool and Bonding Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US123623172025
Semiconductor Die Dipping Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120093372024
Bonding Tool and Bonding Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites