36 Patents
- US125641092026Package Component, Electronic Device and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US125385592026Semiconductor Packages and Methods of Forming
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US125060992025Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
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- US124066862025Techniques for Training a Multitask Learning Model to Assess Perceived Audio Quality
NETFLIX, Inc.
0 cites - US123681322025Joint Structure in Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123619562025Perceptually-based Loss Functions for Audio Encoding and Decoding Based on Machine Learning
Dolby Laboratories Licensing Corporation
0 cites - 0 cites
- US122725682025Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US122374022025Methods of Forming Semiconductor Devices
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd
0 cites - US122306052025Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121836812024Package Structure Having Bridge Structure for Connection Between Semiconductor Dies
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121486612024Method of Forming Integrated Fan-out Packages with Built-in Heat Sink
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd
0 cites - US121487332024Shift Control Method in Manufacture of Semiconductor Device
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121366622024Methods of Forming Semiconductor Devices
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd
0 cites - 0 cites
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- US120877272024Joint Structure in Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US120339492024Package Structure with Bridge Die Laterally Wrapped by Insulating Encapsulant and Surrounded by Through Vias and Method of Forming the Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120339782024Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119903512024Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119904292024Dummy Die Placement Without Backside Chipping
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
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- US118240402023Package Component, Electronic Device and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US118171112023Perceptually-based Loss Functions for Audio Encoding and Decoding Based on Machine Learning
Dolby Laboratories Licensing Corporation
0 cites - US118108312023Integrated Circuit Package and Method of Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US117496072023Package and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
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- US116368722023Techniques for Computing Perceived Audio Quality Based on a Trained Multitask Learning Model
NETFLIX, Inc.
0 cites - US116005952023Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US115575682023Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company. Ltd.
0 cites