Patents/Inventors

Chih-wei Lin

Hsinchu CountyTW73 patents

76 Patents

US125688542026
Semiconductor Packages Having Semiconductor Blocks Surrounding Semiconductor Device
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US125123842025
Semiconductor Package with Electrically Conductive Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US125124192025
Method of Fabricating Memory Device and Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US125124512025
Semiconductor Package and Manufacturing Method of the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124873902025
Polarizer
Benq Materials Corporation
0 cites
US124890302025
Methods of Manufacturing Integrated Fan-out Packages with Embedded Heat Dissipation Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US124712252025
Detachable Cable Cage for Multi-node Computing System
QUANTA COMPUTER Inc.
0 cites
US124630672025
Pickup Apparatus and Method of Using the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124447192025
Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124380072025
Staggered Metal Mesh on Backside of Device Die and Method Forming Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US124296452025
Optical Film
Benq Materials Corporation
0 cites
US124314462025
Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US123971802025
Open Type Breathing-out Particles Capture and Filtration Device
0 cites
US123942422025
Fingerprint Sensor Device and Method
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123947362025
Semiconductor Package System and Method
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123949382025
Force Saving Mechanism for Circuit Board Installation
QUANTA COMPUTER Inc.
0 cites
US123784122025
Resin Composition and Article Made Therefrom
ELITE MATERIAL CO., Ltd.
0 cites
US123826112025
Modular Liquid Cooling for Multi-node Computing Systems
QUANTA COMPUTER Inc.
0 cites
US123581942025
Molded Semiconductor Device and Manufacturing Method of Molded Semiconductor Device
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123622702025
Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123549292025
Package Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123549972025
Package Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123344242025
Package Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123226402025
Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123050732025
Restorable Anti-glare Film
Benq Materials Corporation
0 cites
US123006592025
Aligning Bumps in Fan-out Packaging Process
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123006842025
Semiconductor Packages
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122887292025
Integrated Circuit Package and Method
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122782082025
Method of Fabricating Semiconductor Structure Including a Barrier Structure in Between a Plurality of Surface Mount Components and a Wafer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122289802025
Mounting System for an Electronic Device
QUANTA COMPUTER Inc.
0 cites
US122305492025
Three-dimensional Integrated Circuit Structures and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122180822025
Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121799682024
Formable Stopper
FIVETECH TECHNOLOGY Inc.
0 cites
US121762992024
Semiconductor Device and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121621342024
System with Substrate Carrier Deterioration Detection and Repair
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US121548382024
Semiconductor Arrangement and Method of Forming
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
0 cites
US121487922024
Structure and Formation Method of Semiconductor Device Structure with Gate Stack
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US121257972024
Package Structure with Fan-out Feature
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121070512024
Method of Forming Semiconductor Packages Having Through Package Vias
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120806532024
Formation Method of Chip Package with Fan-out Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120573592024
Semiconductor Package and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120402932024
Redistribution Layer Metallic Structure and Method
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US120339652024
Semiconductor Device and Method of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US120339922024
Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120210372024
Method for Manufacturing Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120118592024
Molding Apparatus and Manufacturing Method of Molded Semiconductor Device
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120093222024
Package Structure with Through-via in Molding Compound and Dielectric Layer
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US120093452024
3D Package Structure and Methods of Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119882462024
Axial-rotation Locking-mechanism Assembly
QUANTA COMPUTER Inc.
0 cites
US119918532024
Cable Clip
QUANTA COMPUTER Inc.
0 cites
US119617912024
Package Structures and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119358042024
Integrated Circuit Package and Method
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119012582024
Iintegrated Fan-out Packages with Embedded Heat Dissipation Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119013192024
Semiconductor Package System and Method
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US118547892023
Method for Manufacturing Gate Structure with Additional Oxide Layer
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US118550062023
Memory Device, Package Structure and Fabricating Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118483002023
Semiconductor Structure Including a Semiconductor Wafer and a Surface Mount Component Overhanging a Periphery of the Semiconductor Wafer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118375502023
Method of Forming Semiconductor Packages Having Through Package Vias
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd
0 cites
US118044342023
Integrated Circuit Apparatus and Power Distribution Network Thereof
REALTEK SEMICONDUCTOR Corp.
0 cites
US117768382023
Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117608762023
Resin Composition and Article Made Therefrom
ELITE MATERIAL CO., Ltd.
0 cites
US117403882023
Anti-glare Film and Polarizer with the Same
Benq Materials Corporation
0 cites
US117313272023
Molding Apparatus and Manufacturing Method of Molded Semiconductor Device
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117321602023
Composite Film for Use in LED Wafer-level Packaging Process
TAIMIDE TECHNOLOGY INCORPORATION
0 cites
US117277142023
Fingerprint Sensor Device and Method
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US117283762023
Structure and Formation Method of Semiconductor Device Structure with Gate Stack
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US117033852023
Light Sensor with Dark Current Elimination Having Duo Switch-capacitor Circuits and a Reverse Capacitor
LUXSENTEK MICROELECTRONICS Corp.
0 cites
US116887252023
Semiconductor Packages
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US116826392023
Semiconductor Device and Method of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US116642872023
Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
0 cites
US116371392023
Semiconductor Device Including Light-collimating Layer and Biometric Device Using the Same
Vanguard International Semiconductor Corporation
0 cites
US116263392023
Integrated Circuit Package and Method
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116118212023
Earphone with Proximity Sensing Function
LUXSENTEK MICROELECTRONICS Corp.
0 cites
US115840192023
Substrate Carrier Deterioration Detection and Repair
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US115878872023
Semiconductor Device and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US115454652023
3D Package Structure and Methods of Forming Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites