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Inventors
Chih-jung Ni
Taichung
TW
2 patents
3 Patents
US12106964
2024
Double-patterning Method to Improve Sidewall Uniformity
Winbond Electronics Corp.
0 cites
US12087619
2024
Semiconductor Device and Method of Fabricating the Same
Winbond Electronics Corp.
0 cites
US11839075
2023
Semiconductor Structure and the Forming Method Thereof
WINBOND ELECTRONICS Corp.
0 cites