Chih-hui Huang

8 Patents

• US125574012026

  Method of Forming Deep Trench Isolation in Radiation Sensing Substrate and Image Sensor Device

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US125282202026

  Ultrasonic Device

  SILICONWARE PRECISION INDUSTRIES CO., Ltd.

  0 cites
• US122371652025

  Method for Wafer Bonding Including Edge Trimming

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.

  0 cites
• US122117412025

  Multi-wafer Capping Layer for Metal Arcing Protection

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US121426282024

  Method of Forming Semiconductor Device

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd

  0 cites
• US119159772024

  Interconnect Structure for Stacked Device

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US118625152024

  Multi-wafer Capping Layer for Metal Arcing Protection

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US116108122023

  Multi-wafer Capping Layer for Metal Arcing Protection

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites